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Toshiba ships early samples of 1200V SiC MOSFETs in bare die...

Mitsubishi Electric to ship samples of SiC-MOSFET bare die for xEVs

Infineon unveils the world’s thinnest silicon power wafer, pushing technical boundaries...

HybridPACK™ Drive G2 Fusion: Infineon combines silicon and silicon carbide in...

Infineon strengthens multi-sourcing strategy in new supplier agreement with SK Siltron...

Coherent’s Silicon Carbide semiconductor business to receive $1B in investments from...

STMicroelectronics drives the future of EVs and industrial applications with new...

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